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首頁> 外文會議>Micromachining and microfabrication process technology XV >Electrode Micropatterning by Microcontact Printing Method to Large Area Substrates Using Nickel Mold
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Electrode Micropatterning by Microcontact Printing Method to Large Area Substrates Using Nickel Mold

機譯:鎳模具通過微接觸印刷法對大面積基板進行電極微圖案化

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Microcontact printing (μCP) was successfully used to micropattern electrodes on large area substrates. An A4-size (210 mm × 297 mm) polydimethylsiloxane (PDMS) elastomer stamp was easily fabricated using an electroformed nickel mold. The micropatterns of poly(3,4-ethylenedioxythiophene)/poly(4-stylenesulfonate) (PEDOT/PSS) and silver (Ag) thin films, which were under 10 μm in width, were fabricated by transferring the thin films on the PDMS elastomer stamp to another substrate by μCP. Bottom contact (BC) organic thin film transistors (OTFTs) with PEDOT/PSS were fabricated as source and drain electrodes. The successful operation of fabricated OTFTs with a channel length of 10 μm was demonstrated. Results show that μCP is a promising process for use with various devices that require micropatterning on large area substrates.
機譯:微接觸印刷(μCP)已成功用于大面積基板上的微圖案電極。使用電鑄鎳模具可輕松制造A4尺寸(210 mm×297 mm)的聚二甲基硅氧烷(PDMS)彈性體印模。通過在PDMS彈性體上轉移薄膜來制作寬度小于10μm的聚(3,4-乙撐二氧噻吩)/聚(4-苯乙烯磺酸鹽)(PEDOT / PSS)和銀(Ag)薄膜的微圖案通過μCP壓印到另一個基板上。具有PEDOT / PSS的底接觸(BC)有機薄膜晶體管(OTFT)被制作為源電極和漏電極。展示了成功制造的溝道長度為10μm的OTFT的操作。結果表明,μCP是一種有前途的工藝,可用于需要在大面積基板上進行微圖案化的各種器件。

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