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首頁> 外文會議>Micromachining and microfabrication process technology XV >Estimation of tool wear compensation during micro-electro-discharge machining of silicon using process simulation
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Estimation of tool wear compensation during micro-electro-discharge machining of silicon using process simulation

機(jī)譯:使用過程仿真估算硅微放電加工過程中的刀具磨損補(bǔ)償

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摘要

A micro-electro-discharge machine (Micro EDM) was developed incorporating a piezoactuated direct drive tool feed mechanism for micromachining of Silicon using a copper tool. Tool and workpiece materials are removed during Micro EDM process which demand for a tool wear compensation technique to reach the specified depth of machining on the workpiece. An in-situ axial tool wear and machining depth measurement system is developed to investigate axial wear ratio variations with machining depth. Stepwise micromachining experiments on silicon wafer were performed to investigate the variations in the silicon removal and tool wear depths with increase in tool feed. Based on these experimental data, a tool wear compensation method is proposed to reach the desired depth of micromachining on silicon using copper tool. Micromachining experiments are performed with the proposed tool wear compensation method and a maximum workpiece machining depth variation of 6% was observed.
機(jī)譯:開發(fā)了一種微壓電放電機(jī)(Micro EDM),該機(jī)械結(jié)合了壓電驅(qū)動的直接驅(qū)動工具進(jìn)給機(jī)構(gòu),可使用銅工具進(jìn)行硅的微加工。在Micro EDM工藝中,刀具和工件材料被去除,這需要一種刀具磨損補(bǔ)償技術(shù)以達(dá)到在工件上加工的指定深度。開發(fā)了現(xiàn)場軸向刀具磨損和加工深度測量系統(tǒng),以研究軸向磨損比隨加工深度的變化。在硅晶片上進(jìn)行了逐步微加工實驗,以研究隨著工具進(jìn)給量的增加,硅去除量和工具磨損深度的變化。基于這些實驗數(shù)據(jù),提出了一種工具磨損補(bǔ)償方法,以使用銅工具在硅上達(dá)到所需的微加工深度。用建議的刀具磨損補(bǔ)償方法進(jìn)行了微加工實驗,觀察到最大工件加工深度變化為6%。

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