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Bio-based composites from soybean oil resins and feather fibers for electronic applications.

機譯：由大豆油樹脂和羽毛纖維制成的生物基復合材料，用于電子應用。

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摘要

Traditional glass fiber reinforced epoxy composites for printed circuit boards (PCBs) are petroleum based, utilize brominated epoxy resins, and are energy intensive with respect tomanufacturing, which designates PCBs as products with a high environmental impact. This work used alternative bio-based materials, specifically, chicken feather fibers (CFFs) and plant oil resins, along with halogen-free flame retardants (FRs) to develop PCB prototypes in order to improve the sustainability of the PCBs. CFFs are keratin proteins with a high content of hydrophobic amino acids, which are compatible with plant oil resins. CFFs had heterogeneous structures which affect their mechanical properties significantly. A helical array of beta-crystallites causes significant anisotropy in the linear thermal expansion of CFFs, which results in negative longitudinal coefficient of thermal expansion (CTE) values. CFFs have hollow structures which contain about 22% voids. The hollow structures ensure that CFFs have a high electrical resistivity and a low dielectric constant, which is suitable for PCB applications. Soybean oil resins were modified to give higher molecular stiffness and cross-link densities, while maintaining low polarity. The new bio-based resins for PCBs have composition-dependent properties with a glass transition temperature (Tg) value of 80-100°C, a storage modulus of 1.8-2.2 GPa, a dielectric constant of 3.6-3.8 and a loss tangent of less than 0.02. Greener, halogen-free PCB prototypes (Bio-PCBs) were developed from CFFs, E-glass and the modified biobased resins. The Bio-PCBs were found to pass most PCB application requirements, such as flame-retardancy, volume and surface resistivities, Tg, etc. This work has demonstrated that it is feasible to use bio-based and greener materials as alternatives for PCBs. These new materials will promote a more sustainable platform for the PCB industry; however, additional characteristics, such as moisture uptake, need to be further investigated and eventual structure-property optimization, such as for peel strength, are recommended for future work.
機譯：用于印刷電路板（PCB）的傳統玻璃纖維增??強環氧復合材料是石油基的，使用溴化環氧樹脂，并且制造能耗高，因此將PCB指定為對環境具有較高影響的產品。這項工作使用替代的生物基材料，特別是雞羽毛纖維（CFF）和植物油樹脂，以及無鹵阻燃劑（FR）來開發PCB原型，以提高PCB的可持續性。 CFF是具有高含量疏水氨基酸的角蛋白，可與植物油樹脂相容。 CFF具有異質結構，會顯著影響其機械性能。 β-微晶的螺旋形陣列會在CFF的線性熱膨脹中引起明顯的各向異性，從而導致負的縱向熱膨脹系數（CTE）值。 CFF具有中空結構，其中包含約22％的空隙。中空結構確保CFF具有高電阻率和低介電常數，適用于PCB應用。對大豆油樹脂進行了改性，使其具有較高的分子剛度和交聯密度，同時保持了低極性。新型用于PCB的生物基樹脂具有與成分有關的特性，玻璃化轉變溫度（Tg）值為80-100°C，儲能模量為1.8-2.2 GPa，介電常數為3.6-3.8，損耗角正切為小于0.02。由CFF，電子玻璃和改性生物基樹脂開發了更綠色，無鹵素的PCB原型（Bio-PCB）。已發現生物PCB滿足大多數PCB應用要求，例如阻燃性，體積和表面電阻率，Tg等。這項工作表明，使用生物基和綠色材料替代PCB是可行的。這些新材料將為PCB行業促進一個更可持續的平臺。但是，還需要進一步研究其他特征（例如水分吸收），并建議在將來的工作中最終優化結構性能（例如剝離強度）。

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  • 作者

    Zhan, Mingjiang.;

  • 作者單位

    University of Delaware.;

  • 授予單位 University of Delaware.;
  • 學科 Engineering Chemical.
  • 學位 Ph.D.
  • 年度 2010
  • 頁碼 246 p.
  • 總頁數 246
  • 原文格式 PDF
  • 正文語種 eng
  • 中圖分類
  • 關鍵詞

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